Windows 7 system, in the English and Chinese interface online arbitrary switch, easy to operate;
SIEMENS PLC+ modular control, stable and reliable performance, higher accuracy:
Double temperature sensor, double safety control mode, the system will automatically cut off the heating power supply;
The upper and lower temperature and wind speed can be designed to meet the requirements of various high precision lead free soldering process;
The new furnace design effectively reduces the temperature difference between the size of the components, to ensure the reliability of the solder joints, the elimination of heat damage to the component;
Stage type forced cooling system to easily achieve the cooling rate all kinds of lead-free solder paste requirements (less than 30 DEG C / s):
Reflow soldering can be equipped with central support and dual rail.