产品特点 ■适合于微加工 ■整机风冷却方式 ■新型半导体激光源，电光转换效率高，使用寿命长 ■倍频转换的效率，较窄的激光脉冲宽度 ■整机能耗低，免维护，可靠性高
Product features ● suitable for micromachining ●Air cooling ●New semiconductor laser source , high electricity-laser exchange ratio, long using lifetime ●Hgh efficiency frequency doubling conversion, narrow laser pulse width ●Low power consuming, maintenance free, stable performance
技术参数 Technical parameter 输出功率 Laser power 6W/12W 激光波长 Wavelength 532nm 光束质量 Beam quality ㎡＜1.3 标刻范围 Marking scope 65×65/110×110/160×160mm(可选 optional) 标刻速度 Marking speed ≤7000mm/s 小线宽 line width 0.01mm 小字符 haracter 0.1mm 脉 宽 Pulse width 20ns(20KHz) 脉冲能量 Pulse energy 150μj(20KHz) 脉冲重复频率 Repeat precision 10-200KHz 供电电源 Power supply 220V±10% 50Hz/12A 整机功耗 Power Consumption 400W 工作温度 Working temperature 5℃--35℃
适用材料 Applicable Materials 大多数金属和非金属的表面加工和镀层薄膜的加工；玻璃和水晶制品的表面雕刻。 Surface processing and coating film processing of most metal and non-metal materials. Surface engraving of glass and crystal products.
适用领域 Applicable field 光学器件，手机屏，LCD屏，汽车玻璃，PCB板，陶瓷，硅片，塑料等行业 Optical device, mobile phone screen, LCD screen, car glass, PCB board, ceramic, silicon, plastic and so on
打印效果
